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VLSI Design Engineer

Industry Focus:Engineering & Architecture, Information Technology, ResearchJob Title:VLSI Design Engineer
Experience:1 – 3 YearsLooking For:Any Position Type, W-2 Contractor, Any Position Type
Visa Status:Non U.S. CitizenSalary:$40000 - $60000
Education Level:Post Graduate DegreeRelocation:Any Location
Travel Preference:Light Travel


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Curriculum Vitae
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Prakash Patil

PL5B-1/15, Sector 10,
Khanda Colony, New Panvel,
Navi Mumbai-410206, INDIA.
Phone +91-22-2748 3233.
Fax 0091-22-2748 3233.
Cell: +91-98199 15540.
E-mail
PraPatil@Gmail.com
PraPatil2k@Yahoo.com
Semiconductor.Career@Gmail.com
prakash.patil.VLSI@Gmail.com

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OBJECTIVE: To seek a challenging position in the field of VLSI / ASIC Design / Process Technology / Test.

EXPERIENCE SUMMARY

One & half years of experience in physical design of Integrated Circuit (IC) on 0.13 micron & 0.18 micron process. Good skills and experience of deep sub micron IO pad library design, verification, and design of test chip, ESD & LATCH-UP issues, and Failure analysis. Programming / Scripting in SKILL, Perl, TCL, C. Good communication skills. Excellent leadership qualities.

SKILLS OFFERED

⇨ ASIC / VLSI Physical Design, Process Technology, Test. Expert Currently used 2 years.
⇨ Software Proficiency: Cadence Tool, Mentor Graphics calibre tool, Hspice / Characterization techniques, ability to develop well-structured and maintainable software tools.Programming / scripting languages like SKILL, Perl and TCL, C, C++ etc.
⇨ O.S. platform: HP UNIX, Win NT, and LINUX.

Professional Experience:
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3/2001 to 8/2002 Philips Semiconductors, The Netherlands. Standard Cell Design Engineer.
⇨ Major role in Shrink CMOS18 micron & CMOS12 micron IO pad library Design. Computer aided physical design of CMOS12 micron library design, verification. Verification & merging of new cells to Standard cell library & maintenance.
⇨ SHRINK CMOS18 library physical design, verification: Verification of new cells, merging of new cells & maintenance of complete SHRINK CMOS18 IO pad library. Complete SHRINK CMOS18 micron IO pad library converted from CMOS 18 IO pad library. All the IO pad layouts of SHRINK 18 micron standard cell library converted from cmos18 library for SHRINK process. It itself is a big project.
⇨ New Physical design Layout like level shifter, PCI, P1394, USB, PECL, SSTL etc.
⇨ A role in the silicon qualification (electrical, ESD and Latch-up issues) of the I/O libraries.
⇨ Design of test chips for IO pads of standard cell library and participation in the testing and failure analysis.
⇨ Besides the general-purpose input, output and bi-directional cells, the current libraries contain new cells developed according industrial standards (SSTL-2, PCI, USB, PECL, etc.).
⇨ Well Versed with Physical Design aspects-Floor Planning, P & R, Clock tree synthesis, links to DRC, LVS, etc. Familiarity with Mentor & Cadence tools, Working knowledge of scripting languages like SKILL, PERL and TCL. Ability to lead a team of engineers.
⇨ Software used: Cadence complete Backend Qualified Design flow (QDF 3.1), Skill scripts, and Calibre Mentor Graphics tool.
⇨ O.S. platform used: WinNT, HP-Unix.
⇨ Team Size: 4.
⇨ Training Undergone: Cadence Qualified Design flow (QDF 3.1): Three & half day of extensive training on complete front end & backend design flow.§ SKILL language: SKILL language for Cadence design tool. Extensive five days of training.


EDUCATION:
I 3/2000 Indian Institute Of Technology Bombay, Mumbai,India.
Master of Technology in Microelectronic (M.Tech.) with GPA 6.85 out of 10.
⇨ Some of the courses studied at M.Tech. are as:
..... ⇨ VLSI Design,
..... ⇨ VLSI Technology,
..... ⇨ Computer Aided Analysis and Design,
..... ⇨ System Hardware Design,
..... ⇨ Physical Electronics,
..... ⇨ Modern Electronic Design Techniques,
..... ⇨ MOS Devices,
..... ⇨ Special Semiconductor Devices,
..... ⇨ Microelectronic Lab.

⇨ Projects at M.Tech:
Study of Multi-layer Multi-chip Architecture. (Carried out at I. I. T. Bombay during year 1998-2000)
Project consists of Design & development of IC interconnects of multi-layer multi-chip architectures. The Elmore delay model is widely used in optimizing the wire sizing area of an interconnect. The wire sizing algorithms such as Optimal Wire Sizing under Elmore Delay, Greedy Wire Sizing Algorithm under the Elmore Delay and Extended Wire Sizing Algorithm under the Elmore Delay considered for the design of an interconnects in the circuit of multi-layer multi-chip architectures. The optimal wire sizing solution satisfies a number of interesting properties such as seperability, monotone and dominance properties. These properties considered at time of design of an interconnects. These algorithms are implemented to get the fruitful results. The code is written in `C language. The results received are the delay required for the signal from source node to the destination node (e.g. driver node to the sink node in the circuit). The time complexity is calculated. User-friendly software developed for complete analysis and design of the interconnects in the circuit.

⇨ Shivaji University Kolhapur, India; Batchler of Engineering in Electronics.


LANGUAGES KNOWN:

English, Hindi, Marathi.
Dutch, French (Beginner).


AREAS OF INTEREST:
ASIC Design.
VLSI Design.
VLSI Fabrication.
VLSI verification & Testing.


Personal Information.
Marital Status Married
Nationality Indian
Passport Id A9784706
Children One

Additional Information:
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⇨ I am confident that my experience, abilities, skills and attitude to keep on learning new things will help me prove the right person for this job, and an asset to the team and your company.
⇨ For more information, Please fell free to contact me at PraPatil@Gmail.com, PraPatil2k@Yahoo.com, Prakash.Patil.VLSI@Gmail.com.

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